Bonded Fin Heat Sink
A bonded fin heatsink are normally used is forced air circulation envoirement as there is no limitation on fin height to fin space ratio. SNS cooling technology offer bonded fin products with ratio as high as 40:1. SNS uses following methods to bond the fin & base
- Low temperature soldering material (ROHS compliant)
- Alluminum filled high Thermally Conductive Epoxy (ROHS compliant) as per following temperature rating.
- low temperature registance epoxy-max working temperature of 175 °F
- High temeprature registance epoxy-max 450 °F
SNS cooling technology offers various combination of base & fin material per details below.
| Base Material | Fin Material | Method of Joining |
|---|---|---|
|
Al Alloy 6061-T651 OR Al Alloy 6063-T5 |
Copper Fin C11000 | ROHS Solder |
|
Al Grade 1100,3003, 3005, 5005, 5052,6061, 7075 |
ROHS Thermally Conductive epoxy (low temperature), or Thermally Conductive epoxy (high temperature) |
|
|
Copper (Various Grades) |
Copper |
ROHS Solder |
Standard Bonded fin
Click here for complete list of bonded fin base profile. Please note that material setup charge will apply if the qty of parts ordered is not sufficient when material is not available in stock at the time of ordering.
Bonded fin with enhanced performance fin profiles
Increases overall performance by about 10-20% depending on fin height & air velocity. Here are few commonly used profiles.
Please email us about your cooling requirements at sales@snscoolingtech.com for design guidance or any further inquiry/information.